ITEC TSURITANI always conscious of the one-of-a-kind manufacturing that can only be made by myself, and aim to be a company that can compete in the world.
In order to respond to the increase in the number of terminals and narrow pitch as semiconductor chips become more highly integrated, we have developed ultra-micro forged pins for connection terminals using wire materials with a wire diameter of 0.05 mm and our proprietary micro-header processing technology. We have developed ultra-micro forged pins for connection terminals using our proprietary micro-header processing technology to meet the increasing number of terminals and narrow pitches.
Since the material flow during the forging process can be controlled in 1 micron increments, we are able to handle T-shaped pins and other complex shapes, and have achieved extremely stable quality.
This product can be applied to Cu pillars for semiconductor chips and medical devices.
Molybdenum header processing
Since molybdenum material is made by sintering and rolling, cracking occurs when forging, making it difficult to process.
We have established our unique warm forging technology for flat, dish, and spherical rivets that minimizes material cracking while maintaining the characteristics of molybdenum materials.
We aim to pioneer forging processing application products using molybdenum materials.
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