Innovation
Technology
Efficiency
Challenge

Our Best Recommended Technique

In order to respond to the increase in the number of terminals and narrow pitch as semiconductor chips become more highly integrated, we have developed ultra-micro forged pins for connection terminals using wire materials with a wire diameter of 0.05 mm and our proprietary micro-header processing technology. We have developed ultra-micro forged pins for connection terminals using our proprietary micro-header processing technology to meet the increasing number of terminals and narrow pitches. Since the material flow during the forging process can be controlled in 1 micron increments, we are able to handle T-shaped pins and other complex shapes, and have achieved extremely stable quality. This product can be applied to Cu pillars for semiconductor chips and medical devices.

Making full use of knowledge over about 100 years of company history, we are proposing different processing that have changed our perspective.

Contact Tsuritani if there are any processing cost problems

Reduction in cost is possible through our various techniques that we have cultivated over many years.